SIMULATION MODELING OF THERMOPLASTIC ADHESIVE WOOD JOINTS USING CAD/CAE SYSTEMS

B.Ya. Kshyvetskyy, V.R. Solonynka

Abstract


Some results of simulation modeling of thermoplastic polyvinyl acetate adhesive wood joints using CAD/CAE systems are presented. Based on CAD/CAE systems, an algorithm has been developed for simulation modeling of stress-strain state in thermoplastic adhesive wood joints depending on ambient temperature and humidity. The library database of CAD/CAE systems was supplemented by physical-and-mechanical and physical-and-chemical characteristics of various wood species and thermoplastic glue mixes. The developed algorithm allows for simulating changes in moisture content, temperature, and stress-strain state at any point of the thermoplastic adhesive wood joints depending on varying ambient temperature and humidity.

Keywords


modeling; algorithm; strength; durability; stress-strain state; adhesive; wood; humidity; adhesive joint; temperature; prediction

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